San Jose, Calif. -- Ultratech, a San Jose-based supplier of lithography and laser-processing systems used to manufacture semiconductor devices, said it has acquired the rights to a collection of patents from IBM. Financial terms of the deal were not disclosed. The acquired assets include fundamental patents in packaging such as C4 bumping, Ball Grid Arrays, lead-free solders and 3D packaging. "Ultratech has periodically purchased patents that it views are key to our business," said Arthur Zafiropoulo, the company's chairman and CEO. "This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base."